TERMIUM Plus®

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bond-to-bond distance [1 record]

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Record 1 2000-08-28

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

The distance measured from the bonding site on the die to the bond impression on the post, substrate land, or fingers, which must be bridged by a bonding wire or ribbon.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

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TERMIUM Plus®, the Government of Canada's terminology and linguistic data bank
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