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face bonding [1 record]

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Record 1 2000-11-02

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
CONT

A face bonded semiconductor chip is one that has circuitry side facing the substrate. Flip chip and beam lead bonding are the two common face bonding methods. Opposite of back bonding.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles

Spanish

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