TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

tape bonding [1 record]

Record 1 1992-08-18

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
DEF

The utilization of a metal or plastic tape material as a support and carrier of a microelectronic component in a gang bonding process.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles
DEF

Technique de connexion qui consiste à monter les puces nues sur une pellicule de type cinématographique (35mm de largeur) sur laquelle est collé un réseau de connexions métalliques qui serviront de sorties pour les puces.

OBS

La soudure des connexions et le montage de la puce sur son support sont réalisés automatiquement. Ce support sert au montage final de la puce dans un boîtier ou sur un circuit hybride.

Spanish

Save record 1

Copyright notice for the TERMIUM Plus® data bank

© Public Services and Procurement Canada, 2024
TERMIUM Plus®, the Government of Canada's terminology and linguistic data bank
A product of the Translation Bureau

Features

Language Portal of Canada

Access a collection of Canadian resources on all aspects of English and French, including quizzes.

Writing tools

The Language Portal’s writing tools have a new look! Easy to consult, they give you access to a wealth of information that will help you write better in English and French.

Glossaries and vocabularies

Access Translation Bureau glossaries and vocabularies.

Date Modified: