TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

BUMPED CHIP [1 record]

Filter results by subject field Alphabetical list of terms

Filter results by subject field

Alphabetical list of terms

Record 1 2005-01-11

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
DEF

A chip that has on its termination pads a bump of solder or other bonding material that is used to bond the chip to external contacts.

OBS

This allows for simultaneous bonding of all leads at once rather than one at a time as in wire bonding.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles

Spanish

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