TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

CERAMIC DUAL IN-LINE PACKAGES [1 record]

Record 1 1995-04-04

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Electronic Systems
DEF

Acronym for CERamic Dual In-line Packages. In one form, the package consists of a pair of ceramic rectangles with a Kovar frame sandwiched between. The bottom ceramic plate is cemented to the frame. A cutout in the frame provides room for the circuit die, which is attached to the ceramic by a glass frit. The closure is completed when the top ceramic plate is bonded, also using a glass frit.

Key term(s)
  • Ceramic Dual In-line Packages

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Ensembles électroniques

Spanish

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