TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

FLAT-PACK [2 records]

Filter results by subject field Alphabetical list of terms

Filter results by subject field

Alphabetical list of terms

Record 1 1989-06-21

English

Subject field(s)
  • Printed Circuits and Microelectronics
DEF

Semiconductor network encapsulated in a thin, rectangular package, with the necessary connecting leads projecting from the edges of the unit.

French

Domaine(s)
  • Circuits imprimés et micro-électronique

Spanish

Save record 1

Record 2 1984-04-11

English

Subject field(s)
  • Electronics
DEF

An alternative form of integrated circuit package in which the leads are brought out in the same plane as the package. Often used where there are many leads required and the package is required to be small.

French

Domaine(s)
  • Électronique
OBS

circuits intégrés.

Spanish

Save record 2

Copyright notice for the TERMIUM Plus® data bank

© Public Services and Procurement Canada, 2024
TERMIUM Plus®, the Government of Canada's terminology and linguistic data bank
A product of the Translation Bureau

Display options

Change the order of display of the official languages of Canada
Option to display the non-official languages (Spanish or Portuguese)
Display definitions, contexts, etc., on records

Features

Language Portal of Canada

Access a collection of Canadian resources on all aspects of English and French, including quizzes.

Writing tools

The Language Portal’s writing tools have a new look! Easy to consult, they give you access to a wealth of information that will help you write better in English and French.

Glossaries and vocabularies

Access Translation Bureau glossaries and vocabularies.

Date Modified: