TERMIUM Plus®

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FLIT-CHIP BONDING [1 record]

Record 1 1992-10-28

English

Subject field(s)
  • Applications of Electronics

French

Domaine(s)
  • Applications de l'électronique
DEF

Technique de montage de puce sur un circuit hybride, dans laquelle la puce, qui comporte des contacts surélevés, est retournée pour être soudée sur un substrat contenant des lignes métalliques conductrices.

Spanish

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