TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

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Record 1 2001-03-15

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

That period of machine cycle at which final adjustments in the location of the second bonding area ... under the tool are made prior to lowering the tool for making the second wire bond.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

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