TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

PLAN SOUDURE [1 record]

Record 1 2000-08-28

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

The values of the bonding machine parameters used when adjusting for bonding. For example, in ultrasonic bonding, the values of the bonding force, time, and ultrasonic power.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

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