TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

DIE SEPARATION [1 record]

Record 1 1997-05-22

English

Subject field(s)
  • Electronic Circuits Technology
DEF

Sawing or otherwise machining a semiconductor wafer into small squares, or dice, from which transistors and diodes can be fabricated.

French

Domaine(s)
  • Technologie des circuits électroniques
DEF

Opération qui brise ou scie la tranche de semiconducteur suivant les lignes de découpe afin d'obtenir des circuits intégrés élémentaires.

CONT

quadrillage d'une tranche en puces.

Spanish

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