TERMIUM Plus®

The Government of Canada’s terminology and linguistic data bank.

HEAT COLUMN [1 record]

Record 1 2001-11-08

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

The heating element in a eutectic die bonder or wire bonder used to bring the substrate up to the bonding temperature.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

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