TERMIUM Plus®

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PEEL BOND [1 record]

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Alphabetical list of terms

Record 1 2001-05-15

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
DEF

Similar to lift-off of the bond with the idea that the separation of the lead from the bonding surface proceeds along the interface of the metallization and substrate insulation rather than the bond-metal surface.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles

Spanish

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