TERMIUM Plus^®

Fiche 1,  Justifications,  Anglais

Record number: 1, Textual support number: 1 DEF

A single square or rectangular piece of semiconductor material into which a specific electrical circuit has been fabricated.  2, fiche 1, Anglais, - die

Record number: 1, Textual support number: 1 CONT

An integrated circuit(IC) is an electronic component that incorporates and interconnects a multitude of miniature electronic devices, mostly transistors, on a single piece of semiconductor material, typically silicon. Many such circuits are jointly manufactured on a thin semiconductor wafer with a diameter of 200 or 300 mm before they get cut apart to become(naked) dies.  3, fiche 1, Anglais, - die

Fiche 1,  Justifications,  Français

Record number: 1, Textual support number: 1 DEF

Petite section de forme rectangulaire d'une tranche où un circuit intégré est gravé.  2, fiche 1, Français, - d%C3%A9

Record number: 1, Textual support number: 1 CONT

[Les chercheurs ont] observé des phénomènes aussi bien déterministes qu'aléatoires, qui semblent expliquer les VPF [variations des procédés de fabrication] ressentis aux échelles du dé et de la tranche.  3, fiche 1, Français, - d%C3%A9

Fiche 1,  Justifications,  Espagnol

Record number: 1, Textual support number: 1 OBS

El dado es una pieza de semiconductor. La tecnología ha evolucionado y la designación de este concepto es raramente utilizada en español. En las fuentes se observa que ha sido absorbido por el concepto designado por microcircuito aunque no compartan el mismo campo semántico.  2, fiche 1, Espagnol, - dado

Fiche 2,  Justifications,  Anglais

Record number: 2, Textual support number: 1 DEF

The polishing [of] the top surface of a wafer aided by a slurry containing an abrasive grit suspended in reactive chemical agents.  2, fiche 2, Anglais, - chemical%20mechanical%20polishing

Record number: 2, Textual support number: 1 OBS

Both metals and oxides can be polished with CMP.  2, fiche 2, Anglais, - chemical%20mechanical%20polishing

Fiche 2,  Justifications,  Français

Record number: 2, Textual support number: 1 CONT

Le polissage mécano-chimique (CMP) est une technique utilisant à la fois la force mécanique et l'affaiblissement chimique pour graduellement retirer une couche de matériau quelconque.  2, fiche 2, Français, - polissage%20m%C3%A9cano%2Dchimique

Record number: 2, Textual support number: 2 CONT

L'incorporation du cuivre dans les niveaux métalliques des puces électroniques a obligé la modification de fabrication des puces. Avant l'aluminium pouvait être gravé, mais le cuivre doit subir quant à lui un polissage mécano-chimique.  4, fiche 2, Français, - polissage%20m%C3%A9cano%2Dchimique

Fiche 2,  Justifications,  Espagnol

Record number: 2, Textual support number: 1 CONT

Pulido mecánico químico: [...] extremadamente importante en los semiconductores. Se basa en [...] partículas abrasivas en solución acuosa [...]  1, fiche 2, Espagnol, - pulido%20mec%C3%A1nico%2Dqu%C3%ADmico

Fiche 3,  Justifications,  Anglais

Record number: 3, Textual support number: 1 DEF

A clock in a case that resembles the container that displays the wafer for the Catholic mass.  1, fiche 3, Anglais, - monstrance%20clock

Fiche 3,  Justifications,  Français

Fiche 3,  Justifications,  Espagnol

Fiche 4,  Justifications,  Anglais

Record number: 4, Textual support number: 1 CONT

A seal is to show that an instrument was executed in a formal manner. At early common law sealing legal documents was of great legal significance. A promise under seal was binding by virtue of the seal. Today under most statutes any stamp, wafer, mark, scroll, or impression made, adopted, and affixed, is adequate. The printed word "seal", or "l. s. ", is sufficient.  2, fiche 4, Anglais, - seal

Record number: 4, Textual support number: 2 CONT

A WHMIS label has different forms. It may be a mark, sign, stamp, sticker, seal, ticket, tag or wrapper. It is attached to, imprinted, stencilled or embossed on the controlled product or its container.  3, fiche 4, Anglais, - seal

Fiche 4,  Justifications,  Français

Record number: 4, Textual support number: 1 DEF

Cachet qui sert à valider un acte en bonne et due forme.  2, fiche 4, Français, - sceau

Record number: 4, Textual support number: 1 CONT

L'étiquetage du SIMDUT peut prendre diverses formes. Il peut s'agir d'une marque, d'un signe, d'une étampe, d'un autocollant, d'un sceau, d'un ticket, d'une étiquette ou d'un emballage, qui peut être attaché au produit ou à son contenant, ou imprimé, marqué au pochoir ou imprimé en relief.  3, fiche 4, Français, - sceau

Record number: 4, Textual support number: 1 OBS

Au début de la période du droit coutumier, l'apposition du sceau sur les actes revêtait une grande importance au point de vue juridique. Une promesse ainsi scellée était irrévocable. De nos jours, d'après la plupart des lois, il suffit d'adopter ou d'apposer un timbre, un cachet, une empreinte, ou de faire une marque ou une impression. L'inscription du mot «sceau» ou de «l.s.» («locus sigilli», place du sceau) suffit également.  4, fiche 4, Français, - sceau

Fiche 4,  Justifications,  Espagnol

Fiche 5,  Justifications,  Anglais

Record number: 5, Textual support number: 1 CONT

We are planning to export... wafer level packaged detectors... [This organization] will use the products to develop [a] laboratory evaluation camera system to test and characterize the sensor for performance and functionality.  1, fiche 5, Anglais, - wafer%20level%20packaged%20detector

Fiche 5,  Justifications,  Français

Fiche 5,  Justifications,  Espagnol

Fiche 9,  Justifications,  Anglais

Record number: 9, Textual support number: 1 CONT

The adsorption of two polymers(polydimethylacrylamide and polydiethylacrylamide) on the inner surface of a fused silica of capillary(or wafer) was investigated by means of atomic force microscopy(AFM), multi-angle laser light scattering(MALLS) technique, and by measuring the electroosmotic flow(EOF) and contact angle. The AFM images showed that PDMA and PDEA tightly adsorbed on the fused silica surface and formed stable coatings.  2, fiche 9, Anglais, - polydimethylacrylamide

Fiche 9,  Justifications,  Français

Record number: 9, Textual support number: 1 CONT

[Des physico-chimistes ont réalisé des expériences] sur deux gels, l’un à base de polydiméthylacrylamide (PDMA), l’autre à base de polyacrylamide (PA), le premier ayant une affinité pour la silice, mais pas le second. Quand on étale une goutte de solution de nanoparticules de silice (d’environ 15 nanomètres de diamètre) sur un morceau de PMDA, et que l’on joint ce morceau à un autre en exerçant une pression durant quelques secondes, on obtient une forte adhésion entre les deux pièces. En revanche, avec du gel de PA, les deux morceaux ne se collent pas, même après une pression prolongée [...]  3, fiche 9, Français, - polydim%C3%A9thylacrylamide

Fiche 9,  Justifications,  Espagnol

Fiche 10,  Justifications,  Anglais

Record number: 10, Textual support number: 1 CONT

Thinned self-supporting wafers have been prepared, and the effects of doping level, wafer thickness and back surface treatment have been studied. The results showed that the back surface recombination velocity can be improved to an acceptable value, leading to the efficient emission of electrons and consequently high values of transmission photoemission and secondary electron multiplication.  2, fiche 10, Anglais, - back%20surface%20recombination%20velocity

Fiche 10,  Justifications,  Français

Record number: 10, Textual support number: 1 CONT

L'industrialisation de cellules minces (épaisseur inférieure à 200 µm) passe nécessairement par la mise en œuvre d'un procédé de réduction de la vitesse de recombinaison en face arrière.  2, fiche 10, Français, - vitesse%20de%20recombinaison%20en%20face%20arri%C3%A8re

Fiche 10,  Justifications,  Espagnol

Fiche 11,  Justifications,  Anglais

Record number: 11, Textual support number: 1 CONT

The technical name for these lasers is vertical-cavity surface-emitting lasers, or VCSELs("vixels"). The technology differs from that of other types of semiconductor lasers, which are long, rectangular structures that beam light out the sides and that show up in everything from CD players to transoceanic fiber-optic networks. The tiny vertical lasers, in contrast, eject photons from the surface of the semiconductor wafer on which they are manufactured, a design that offers distinct manufacturing advantages over edge emitters.  1, fiche 11, Anglais, - vertical%2Dcavity%20surface%2Demitting%20laser

Fiche 11,  Justifications,  Français

Fiche 11,  Justifications,  Espagnol

Record number: 11, Textual support number: 1 CONT

Los láseres de emisión superficial (SEL) o láseres de emisión superficial con cavidad vertical (VCSEL) resuelven estos problemas. Se pueden producir en gran número sobre una oblea y el rayo emerge perpendicularmente a la oblea. Los dispositivos se pueden hacer también muy pequeños de forma que la corriente umbral es del orden de microamperios.  1, fiche 11, Espagnol, - l%C3%A1ser%20de%20emisi%C3%B3n%20superficial%20con%20cavidad%20vertical

Fiche 12,  Justifications,  Anglais

Record number: 12, Textual support number: 1 DEF

A symbol of authenticity. An impression made by means of an instrument or device, such as an engraved metallic plate, on wax or wafer affixed to an instrument, or directly upon the instrument itself. A scroll or other distinguishing mark placed upon an instrument as a seal. The word "seal" placed upon an instrument. The abbreviation "L. S. "placed upon an instrument as a legal seal. An essential of a deed at common law and under some statutes, but disappearing from the requirement of the law with the expansion of literacy and the corresponding ability of a grantor to affix his own signature with legibility sufficient to authenticate the instrument as one representing his own act and deed.(Ballentine, 3rd ed., 1969, p. 1147)  1, fiche 12, Anglais, - seal

Fiche 12,  Justifications,  Français

Record number: 12, Textual support number: 1 OBS

sceau : terme normalisé par le Comité de normalisation dans le cadre du Programme national de l'administration de la justice dans les deux langues officielles (PAJLO).  2, fiche 12, Français, - sceau

Fiche 12,  Justifications,  Espagnol

Fiche 13,  Justifications,  Anglais

Record number: 13, Textual support number: 1 DEF

A type of lock that uses a set of flat wafers to prevent the lock from opening unless the correct key is inserted.  1, fiche 13, Anglais, - wafer%20tumbler%20lock

Record number: 13, Textual support number: 1 CONT

A wafer tumbler however uses a system by which flat pieces of metal named “wafers” must be pushed to the correct position whereby they become flush with the plug and therefore can rotate.  2, fiche 13, Anglais, - wafer%20tumbler%20lock

Record number: 13, Textual support number: 1 OBS

This type of lock is similar to the pin tumbler lock and works on a similar principle. However, unlike the pin tumbler lock, the wafer is a single piece. The wafer tumbler lock is often incorrectly referred to as a disc tumbler lock, which uses an entirely different mechanism.  1, fiche 13, Anglais, - wafer%20tumbler%20lock

Fiche 13,  Justifications,  Français

Record number: 13, Textual support number: 1 CONT

À noter une variante de serrure à goupille et à gorge, la serrure à paillettes : la clef est introduite dans une série de plaquettes trouées. La forme de la clef fait coulisser ces plaquettes de manière à ce qu'elles ne gênent plus la rotation. Les principes de crochetages sont les mêmes, en plus faciles, que les serrures à goupilles. C'est le genre de serrures qu'on trouve sur les placards quelconques dans les entreprises et sur les boîtes aux lettres.  2, fiche 13, Français, - serrure%20%C3%A0%20paillettes

Record number: 13, Textual support number: 1 OBS

Les serrures bon marché que l'on trouve sur les bureaux sont équipées de paillettes en métal au lieu de goupilles. [...] Les paillettes ont toutes le même contour extérieur, mais chaque usinage interne est différent.  3, fiche 13, Français, - serrure%20%C3%A0%20paillettes

Fiche 13,  Justifications,  Espagnol

Fiche 14,  Justifications,  Anglais

Record number: 14, Textual support number: 1 OBS

"wafer" : a thin disk or ring resembling a wafer and variously used(as for a valve, diaphragm, or tumbler in a lock).  2, fiche 14, Anglais, - wafer%20valve

Fiche 14,  Justifications,  Français

Record number: 14, Textual support number: 1 OBS

"robinet à papillon sans brides" (en anglais : "wafer butterfly valve").  2, fiche 14, Français, - robinet%20sans%20brides

Record number: 14, Textual support number: 2 OBS

"robinet à papillon sans brides" : Type de robinet à papillon dont le corps plat permet un montage entre brides, c'est-à-dire entre les deux brides de la tuyauterie, sans comporter lui-même de brides.  2, fiche 14, Français, - robinet%20sans%20brides

Fiche 14,  Justifications,  Espagnol

Fiche 15,  Justifications,  Anglais

Record number: 15, Textual support number: 1 CONT

Polishing and planarization are related in that polishing improves the flatness(planarity), smoothness and optical properties of a surface. Planarization, however, is a much more critical process. Integrated circuit(IC) manufacturers must planarize each surface layer of an in-process wafer to make it level for the next application of microlithography. Chemical mechanical planarization(CMP) is used during the semiconductor manufacturing process to planarize individual layers in complex integrated circuits to customer-specific parameters.  2, fiche 15, Anglais, - chemical%20mechanical%20planarization

Fiche 15,  Justifications,  Français

Record number: 15, Textual support number: 1 CONT

La société [Novellus Systems Inc.] est spécialisée dans les équipements avancés pour la déposition, le traitement de surface et la planarisation chimico-mécanique conçus pour les besoins de la fabrication de masse de semi-conducteurs au moindre coût.  5, fiche 15, Français, - planarisation%20chimico%2Dm%C3%A9canique

Fiche 15,  Justifications,  Espagnol

Fiche 16,  Justifications,  Anglais

Record number: 16, Textual support number: 1 CONT

Contact failure occurs when the closed resistance is too high or open resistance too low.  2, fiche 16, Anglais, - contact%20failure

Record number: 16, Textual support number: 2 CONT

When a test is conducted on a semiconductor wafer having such a high-load electrode by adopting the contact board of the first embodiment, there is a risk that impact on the high-load electrode and a contact failure between other electrode and a via of the contact board might occur.  3, fiche 16, Anglais, - contact%20failure

Fiche 16,  Justifications,  Français

Fiche 16,  Justifications,  Espagnol

Fiche 17,  Justifications,  Anglais

Record number: 17, Textual support number: 1 DEF

A junction produced by alloying one or more impurity metals to a semiconductor.  4, fiche 17, Anglais, - alloy%20junction

Record number: 17, Textual support number: 1 OBS

A small button of impurity metal is placed at each desired location on the semiconductor wafer, heated above the melting point, and cooled. The impurity metal alloys with the semiconductor material to form a p or n region, depending on the impurity used.  4, fiche 17, Anglais, - alloy%20junction

Record number: 17, Textual support number: 2 OBS

alloyed junction: term standardized by the International Electrotechnical Commission (IEC).  5, fiche 17, Anglais, - alloy%20junction

Record number: 17, Textual support number: 1 PHR

Alloy-junction transistor.  5, fiche 17, Anglais, - alloy%20junction

Fiche 17,  Justifications,  Français

Record number: 17, Textual support number: 1 DEF

Jonction obtenue par la fusion d'un métal sur la surface d'un matériau semiconducteur.  4, fiche 17, Français, - jonction%20par%20alliage

Record number: 17, Textual support number: 1 OBS

Au refroidissement, le semiconducteur se recristallise en incorporant l'impureté du métal d'alliage.  4, fiche 17, Français, - jonction%20par%20alliage

Record number: 17, Textual support number: 2 OBS

jonction par alliage : terme normalisé par la Commission électrotechnique internationale (CEI).  5, fiche 17, Français, - jonction%20par%20alliage

Record number: 17, Textual support number: 1 PHR

Transistor à jonction par alliage.  5, fiche 17, Français, - jonction%20par%20alliage

Fiche 17,  Justifications,  Espagnol

Fiche 18,  Justifications,  Anglais

Record number: 18, Textual support number: 1 CONT

Electrical feedthrough in silicon wafers used for modules can be fabricated using the following steps : opening holes from both sides of a silicon wafer; oxidizing the surface of the wafer : depositing metal layers on the wafer; subetching the metal films to form pads; placing pins on top of the pads and reflowing the metal to join the pads to the pins.  1, fiche 18, Anglais, - subetching

Fiche 18,  Justifications,  Français

Record number: 18, Textual support number: 1 CONT

Schéma de principe d'une gravure humide isotrope : 1. le substrat est protégé localement par un masque, généralement une résine photosensible; 2. le substrat est plongé dans le bain d'attaque chimique et le matériau visé se dégrade; 3. le caractère isotropique de cette attaque donne des formes spécifiques et le matériau est gravé dans tout son volume et non pas uniquement à la verticale sous le masque : c'est la sous-gravure; 4. fin de la gravure, les flans de la couche usinée ne sont pas strictement verticaux, mais ce problème,comme celui de la sous-gravure, est maîtrisé par un masque adapté et les choix judicieux du bain et du temps de trempe.  2, fiche 18, Français, - sous%2Dgravure

Fiche 18,  Justifications,  Espagnol

Fiche 19,  Justifications,  Anglais

Record number: 19, Textual support number: 1 DEF

A robotic gripper that employs a suction cup and a vacuum source to manipulate objects.  3, fiche 19, Anglais, - vacuum%20gripper

Record number: 19, Textual support number: 1 CONT

Vacuum grippers are typically found at the end of robot arms.  3, fiche 19, Anglais, - vacuum%20gripper

Record number: 19, Textual support number: 2 CONT

A variation on the vacuum cup gripper... has been used extensively for lifting fragile silicon wafers. A compressed air supply(which is often easier to obtain than a vacuum pump) and a venturi are used to create a gentle vacuum that lifts the wafer and holds it in place.  2, fiche 19, Anglais, - vacuum%20gripper

Fiche 19,  Justifications,  Français

Record number: 19, Textual support number: 1 DEF

Organe terminal d'un robot saisissant un objet par une ventouse appliquée sur une surface plane, le vide étant fait dans la ventouse au moment de la saisie.  2, fiche 19, Français, - pr%C3%A9henseur%20%C3%A0%20ventouse

Record number: 19, Textual support number: 1 CONT

Après l'échauffement, le troisième robot, à nouveau un KR 150 L110 K, cherche le revêtement, avec son préhenseur à ventouse, pour le déposer sur la table tournante de l'installation de découpe au laser où un KR 30 supplémentaire procédera à la découpe de la zone pour [le coussin gonflable].  3, fiche 19, Français, - pr%C3%A9henseur%20%C3%A0%20ventouse

Fiche 19,  Justifications,  Espagnol

Fiche 20,  Justifications,  Anglais

Record number: 20, Textual support number: 1 DEF

A form of thin film silicon with very small (0.5-2 micron) grain structure intermixed with amorphous silicon.  1, fiche 20, Anglais, - micro%2Dcrystalline%20silicon

Record number: 20, Textual support number: 1 CONT

Microcrystalline silicon... consists of crystalline grains that are embedded in an amorphous material. This means that microcrystalline silicon has optical characteristics like crystalline wafer material, but can be applied to any surface, for example via plasma deposition.  2, fiche 20, Anglais, - micro%2Dcrystalline%20silicon

Record number: 20, Textual support number: 1 OBS

It is usually deposited in a thin layer (typically 1-3 microns) for tandem (stacked) thin film solar cells.  1, fiche 20, Anglais, - micro%2Dcrystalline%20silicon

Fiche 20,  Justifications,  Français

Record number: 20, Textual support number: 1 DEF

[Matériau obtenu] en introduisant une forte proportion d'hydrogène gazeux dans le plasma de silane destiné à produire du silicium amorphe [ce qui crée] dans le matériau en croissance une certaine proportion de micrograins cristallisés.  1, fiche 20, Français, - silicium%20microcristallin

Fiche 20,  Justifications,  Espagnol

Fiche 21,  Justifications,  Anglais

Record number: 21, Textual support number: 1 DEF

A thin sheet of semiconductor (photovoltaic material) made by cutting it from a single crystal or ingot.  3, fiche 21, Anglais, - wafer

Record number: 21, Textual support number: 1 CONT

[A wafer is] a round disc of semiconductor material [that is] most commonly silicon, although gallium arsenide and other semiconductor materials are also used. Wafers are a few millimeters thick and are available in a variety of diameters... Many integrated circuits are simultaneously fabricated on wafers during the wafer fabrication process.  4, fiche 21, Anglais, - wafer

Record number: 21, Textual support number: 2 CONT

Slice [is] another term for wafer, most often used during wafer manufacture where wafers are sliced from an ingot.  4, fiche 21, Anglais, - wafer

Fiche 21,  Justifications,  Français

Record number: 21, Textual support number: 1 DEF

Disque de faible épaisseur découpé dans un lingot monocristallin de matériau semiconducteur et utilisé comme matériau de base pour réaliser un ou plusieurs circuits ou composants en une seule fois.  4, fiche 21, Français, - tranche

Fiche 21,  Justifications,  Espagnol

Record number: 21, Textual support number: 1 DEF

Fina plancha de material semiconductor [...] sobre la que se construyen microcircuitos [...]  2, fiche 21, Espagnol, - oblea

Fiche 22,  Justifications,  Anglais

Record number: 22, Textual support number: 1 DEF

A furnace used to make junctions in semiconductors by diffusing dopant atoms into the surface of the material.  3, fiche 22, Anglais, - diffusion%20furnace

Record number: 22, Textual support number: 1 CONT

Diffusion process systems are used in the manufacture of solid state devices for discrete as well as integrated circuit components. The end use of these products ranges from a single transistor in a portable radio to semiconductor memory used in computers. In the manufacture of typical integrated circuits, various elevated temperatures and gaseous atmospheres are required. Diffusion furnaces are operated at temperatures between 1000 to 1300 ° C. Thermal uniformity is critical in order to allow insertion of a large number of wafers into the furnace... Deposition systems, of which there are three(liquid, gaseous, solid), are used to deposit impurities on the silicon wafer.  4, fiche 22, Anglais, - diffusion%20furnace

Fiche 22,  Justifications,  Français

Record number: 22, Textual support number: 1 DEF

Appareil dans lequel on chauffe les tranches de silicium à une température voisine de leur température de fusion (entre 900 et 1200 °C), en présence d'une vapeur dopante, en vue d'introduire des atomes d'une impureté dans la masse du semi-conducteur.  1, fiche 22, Français, - four%20de%20diffusion

Record number: 22, Textual support number: 1 OBS

L'impureté se condense sur la surface de la tranche et diffuse ensuite dans l'épaisseur du substrat.  1, fiche 22, Français, - four%20de%20diffusion

Fiche 22,  Justifications,  Espagnol

Fiche 23,  Justifications,  Anglais

Record number: 23, Textual support number: 1 DEF

A blend of low-fat cocoa powder, milk solids, sugar, salt and fat that has similar characteristics to chocolate.  2, fiche 23, Anglais, - compound%20coating

Record number: 23, Textual support number: 1 OBS

Used for coating various cookie and wafer products.  3, fiche 23, Anglais, - compound%20coating

Record number: 23, Textual support number: 2 OBS

Term used at the Canadian Grain Commission.  4, fiche 23, Anglais, - compound%20coating

Fiche 23,  Justifications,  Français

Record number: 23, Textual support number: 1 DEF

Mélange de cacao en poudre à faible teneur en matières grasses, d'extraits secs du lait, de sucre, de sel et de matières grasses qui présente les mêmes caractéristiques que le chocolat.  2, fiche 23, Français, - enrobage%20compos%C3%A9

Record number: 23, Textual support number: 1 OBS

Ce mélange sert à enrober divers biscuits et gaufrettes.  3, fiche 23, Français, - enrobage%20compos%C3%A9

Record number: 23, Textual support number: 2 OBS

Terme en usage à la Commission canadienne des grains.  4, fiche 23, Français, - enrobage%20compos%C3%A9

Fiche 23,  Justifications,  Espagnol

Fiche 24,  Justifications,  Anglais

Record number: 24, Textual support number: 1 DEF

A process used to coat the wafer with material which is originally in the liquid form...  1, fiche 24, Anglais, - spin%2Don%20deposition

Record number: 24, Textual support number: 1 OBS

... liquid is dispensed onto the wafer surface in predetermined amount and the wafer is rapidly rotated(up to 6000 rpm; during spinning liquid is uniformly distributed on the surface by centrifugal forces; material is then solidified by low temperature(typically <200°C) bake; in semiconductor processing commonly used to apply photoresist.  1, fiche 24, Anglais, - spin%2Don%20deposition

Record number: 24, Textual support number: 1 CONT

Antireflection coatings are applied primarily by evaporation; the process can be continuous if the vacuum system has suitable pumped entrance and exit ports. Other means of coating include spraying, dipping, and spinning-on liquids that dry and are then heated to densify them.  2, fiche 24, Anglais, - spin%2Don%20deposition

Fiche 24,  Justifications,  Français

Record number: 24, Textual support number: 1 CONT

[Pile solaire - couche antireflet] La technique par rotation [...] s'apparente aux méthodes d'étalement d'une résine photosensible, le composé se répand uniformément sur la surface par rotation du substrat semi-conducteur.  1, fiche 24, Français, - technique%20par%20rotation

Fiche 24,  Justifications,  Espagnol

Fiche 25,  Justifications,  Anglais

Record number: 25, Textual support number: 1 OBS

The title comes from its appearance : When you cut into the dessert, the different colors of Jell-O resemble stained glass framed by whipped cream. For pies, the mixture is turned into a baked pie crust, graham cracker crust or chocolate wafer crust. The other branch of the family pairs the mixture with lady fingers, angel food cake, chunks of butter cake or even cake crumbs. Fruit is sometimes added.  4, fiche 25, Anglais, - stained%20glass%20dessert

Record number: 25, Textual support number: 2 OBS

There are perhaps a dozen variations, all operating on the same principle: Make different colors/flavors of firm Jell-O. Cut this into cubes and gently fold into whipped cream or whipped topping.  4, fiche 25, Anglais, - stained%20glass%20dessert

Fiche 25,  Justifications,  Français

Record number: 25, Textual support number: 1 DEF

Dessert composé de plusieurs saveurs de jello coupé en cubes et mélangés avec de la crème fouettée.  3, fiche 25, Français, - dessert%20aux%20joyaux%20de%20la%20couronne

Fiche 25,  Justifications,  Espagnol

Fiche 26,  Justifications,  Anglais

Record number: 26, Textual support number: 1 CONT

To create a wafer from silicon, purified polycrystalline silicon is heated to a molten liquid. A small piece of solid silicon is placed on the molten liquid, and as the seed is pulled from the molten liquid, it cools to form a single crystal ingot. The crystal ingot is ground to a uniform diameter and diamond saw blade cuts the ingot into thin slices of less than 1 mm thickness. This silicon wafer is then chemically polished to give it a reflective luster.  2, fiche 26, Anglais, - silicon%20wafer

Record number: 26, Textual support number: 1 OBS

[A wafer is] a round disc of semiconductor material [that is] most commonly silicon, although gallium arsenide and other semiconductor materials are also used.  3, fiche 26, Anglais, - silicon%20wafer

Record number: 26, Textual support number: 1 PHR

Blank silicon wafer.  4, fiche 26, Anglais, - silicon%20wafer

Fiche 26,  Justifications,  Français

Record number: 26, Textual support number: 1 CONT

Une fois recouverte de résine, la tranche de silicium est soumise à une lumière visible ou à un rayonnement ultraviolet (UV) à travers un masque représentant le motif recherché.  4, fiche 26, Français, - tranche%20de%20silicium

Record number: 26, Textual support number: 2 CONT

[...] les principales phases de la fabrication d'un circuit intégré comprennent dans la plupart des cas [...] la réalisation collective des circuits sur des rondelles de silicium, par application d'un procédé technologique [...]  3, fiche 26, Français, - tranche%20de%20silicium

Record number: 26, Textual support number: 1 PHR

Plaquette de silicium vierge.  5, fiche 26, Français, - tranche%20de%20silicium

Fiche 26,  Justifications,  Espagnol

Record number: 26, Textual support number: 1 DEF

Pedazo de un lingote de silicio sobre el que se fabrican circuitos integrados.  2, fiche 26, Espagnol, - oblea%20de%20silicio

Record number: 26, Textual support number: 1 OBS

Después de su fabricación y prueba, la oblea se corta en diminutas pastillas o plaquetas que luego se utilizan como componentes de circuitos integrados terminados siendo encapsulados posteriormente.  2, fiche 26, Espagnol, - oblea%20de%20silicio

Fiche 27,  Justifications,  Anglais

Record number: 27, Textual support number: 1 DEF

A furnace for high temperature processing of semiconductor wafers in which process tube is located horizontally, i.e. parallel to the ground ...  1, fiche 27, Anglais, - horizontal%20furnace

Record number: 27, Textual support number: 1 OBS

[It is] used in semiconductor processing for oxidation, CVD [chemical vapour deposition], diffusion and anneals; batch process; inferior to vertical furnace in terms of the foot print, wafer loading automation, and heating uniformity.  1, fiche 27, Anglais, - horizontal%20furnace

Fiche 27,  Justifications,  Français

Fiche 27,  Justifications,  Espagnol

Fiche 28,  Justifications,  Anglais

Record number: 28, Textual support number: 1 OBS

Laser annealing of ion-implantation damage was perhaps the first area of laser processing investigated. This is one reason why there is wide-spread use of the term laser annealing to describe the entire field of laser wafer processing. The laser's ability in the following areas is well documented-for instance, the annealing of : 1. Polycrystaline silicon to increase grain size, 2. Polysilicon films to decrease sheet resistivity, 3. Ion implantation to diffuse dopant, 4. Ion implantation to heal stress areas, but the laser wafer annealer has applications beyond this, including : 1. Trimming resistors and capacitors, 2. Serializing wafers, 3. IC failure analysis, 4. Mask repair.  2, fiche 28, Anglais, - laser%20annealing

Fiche 28,  Justifications,  Français

Fiche 28,  Justifications,  Espagnol

Fiche 29,  Justifications,  Anglais

Record number: 29, Textual support number: 1 DEF

The resistance in semiconductor device in the direction of current flow; typically resistance associated with limited conductivity of semiconductor itself, e. g. resistance of the bulk of semiconductor wafer in the case current flows from the top to back surface of the wafer.  1, fiche 29, Anglais, - series%20resistance

Fiche 29,  Justifications,  Français

Record number: 29, Textual support number: 1 DEF

Résistance d'un dispositif à semiconducteur passant dans le sens du courant, notamment celle que l'on associe à la conduction limitée propre au semiconducteur.  2, fiche 29, Français, - r%C3%A9sistance%20s%C3%A9rie

Record number: 29, Textual support number: 1 CONT

Les diodes semiconductrices [...] Caractéristique statique de la diode PN. [...] L'épaisseur de semiconducteur de type «P» [équivaut] à une résistance : R_sp. L'épaisseur de semiconducteur de type «N» [équivaut] à une résistance : R_sn. On regroupe ces 2 résistances en une seule appelée la résistance série : R_s.  3, fiche 29, Français, - r%C3%A9sistance%20s%C3%A9rie

Fiche 29,  Justifications,  Espagnol

Fiche 30,  Justifications,  Anglais

Record number: 30, Textual support number: 1 DEF

Name given to a flour and water wafer, originally Swedish and made from rye flour, but [which] may be made from wheat flour.  3, fiche 30, Anglais, - flat%20bread

Record number: 30, Textual support number: 1 OBS

It has a much lower water content than bread and some brands are richer in protein because of added wheat gluten ...  3, fiche 30, Anglais, - flat%20bread

Record number: 30, Textual support number: 2 OBS

For a flat-bread-style snack the product is forced through the die and continues to the toasting oven in long stands. After toasting the product is cut to size.  1, fiche 30, Anglais, - flat%20bread

Record number: 30, Textual support number: 3 OBS

Flat bread: The term also designate a category of bread, ex. Lebanese bread.  2, fiche 30, Anglais, - flat%20bread

Fiche 30,  Justifications,  Français

Record number: 30, Textual support number: 1 DEF

Produit à base de céréales, généralement fabriqué par cuisson-extrusion, qui est extrudé sous formes de bandes continues qui sont ensuite coupées en tranches et toastées.  1, fiche 30, Français, - pain%20plat

Record number: 30, Textual support number: 1 OBS

Les caractéristiques du pain plat sont principalement ses dimensions, sa structure alvéolée (taille, régularité) et sa croustillance. Sur le plan commercial, il est surtout en concurrence avec les biscottes et le pain braisé.  1, fiche 30, Français, - pain%20plat

Fiche 30,  Justifications,  Espagnol

Fiche 31,  Justifications,  Anglais

Record number: 31, Textual support number: 1 DEF

A round wafer used during the celebration of the Eucharist.  2, fiche 31, Anglais, - host

Fiche 31,  Justifications,  Français

Record number: 31, Textual support number: 1 DEF

Pain eucharistique, fait de farine sans levain, rappelant la Pâque juive et la sortie d'Égypte.  2, fiche 31, Français, - hostie

Record number: 31, Textual support number: 1 OBS

Le prêtre la consacre au cours de la célébration eucharistique.  2, fiche 31, Français, - hostie

Record number: 31, Textual support number: 2 OBS

De nos jours les hosties sont très minces, petites et distribuées une à une aux communiants; seule l'hostie du célébrant est de grande dimension.  3, fiche 31, Français, - hostie

Fiche 31,  Justifications,  Espagnol

Fiche 32,  Justifications,  Anglais

Record number: 32, Textual support number: 1 CONT

There are several different types of photoelectric cells. In some [i. e., phototubes] there is a light-sensitive surface [a photocathode] which emits electrons and a second electrode, usually maintained at a fairly high positive potential, which collects the electrons... A second type is the photovoltaic or barrier layer photocell in which incident light produces an emf between two terminals... Solar cells, widely used to provide energy for satellites and space vehicles, are photovoltaic cells converting radiant energy into electrical energy. A familiar form uses a very perfect silicon crystal which is treated with trace impurities to introduce extra positive charges on one side of a thin wafer and extra negative charges on the other side... Radiant energy disturbs the electrical balance of the charges and thereby induces an emf which continues as long as light strikes the crystal... A third type of photoelectric cell [photoconductive, or photoresistive cell] utilizes the photoconductivity effect.  6, fiche 32, Anglais, - photoelectric%20receptor

Record number: 32, Textual support number: 1 OBS

The term photoelectric cell, or photocell, should not be used for a phototube, which is a vacuum tube and not a cell.  1, fiche 32, Anglais, - photoelectric%20receptor

Record number: 32, Textual support number: 2 OBS

electric eye: The layman’s term for a photoelectric cell. Also used to designate an unrelated type of electronic device (a magic eye) used for tuning radio receivers.  1, fiche 32, Anglais, - photoelectric%20receptor

Fiche 32,  Justifications,  Français

Record number: 32, Textual support number: 1 OBS

Dans le Dictionnaire de Physique (J.P. Mathieu, 1983), on décrit trois catégories de cellules photoélectriques, soit : 1) les cellules photoémissives (syn. : phototubes - qui ne font pas appel aux matériaux semiconducteurs); 2) les cellules photovoltaïques; 3) les cellules photoconductrices (ou photorésistantes), ces deux dernières catégories nécessitant l'emploi de semiconducteurs. Dans l'Encyclopédie internationale des sciences et des techniques on utilise le terme dans ce même sens général. Par contre, dans le Dictionnaire mémento d'électronique, Dunot, éd. Paris 1969, page 59, on exclut les phototubes. On retrouve donc, en français, la même diversité de sens des termes qu'en anglais. Cette fiche traite de ces termes dans leur sens le plus large.  1, fiche 32, Français, - r%C3%A9cepteur%20photo%C3%A9lectrique

Record number: 32, Textual support number: 2 OBS

photoélectrique : Cette graphie, puisée des Rectifications de l'orthographe recommandées par le Conseil supérieur de la langue française, est attestée dans le Petit Robert (2004).  5, fiche 32, Français, - r%C3%A9cepteur%20photo%C3%A9lectrique

Record number: 32, Textual support number: 1 PHR

Selenium photocell.  6, fiche 32, Français, - r%C3%A9cepteur%20photo%C3%A9lectrique

Fiche 32,  Justifications,  Espagnol

Fiche 33,  Justifications,  Anglais

Record number: 33, Textual support number: 1 CONT

... If the chin needs to be lengthened in the vertical direction, a wafer of material can be placed along the bone cut line to achieve this goal.  1, fiche 33, Anglais, - cut%20line

Fiche 33,  Justifications,  Français

Record number: 33, Textual support number: 1 CONT

L'ordinateur permet de répéter à l'avance [la reconstruction des os de la face] à l'écran : il montre en trois dimensions les traits de coupe voulus par le chirurgien dans les os, le résultat des déplacements sur le squelette, et aligne au dixième de millimètre près les fragments osseux.  1, fiche 33, Français, - trait%20de%20coupe

Fiche 33,  Justifications,  Espagnol

Fiche 34,  Justifications,  Anglais

Record number: 34, Textual support number: 1 DEF

... a crisp conical wafer usually about five inches long holding ice cream.  2, fiche 34, Anglais, - ice%20cream%20cone

Fiche 34,  Justifications,  Français

Record number: 34, Textual support number: 1 OBS

cornet : Cône de pâtisserie dans lequel on présente une crème glacée.  2, fiche 34, Français, - cornet%20de%20cr%C3%A8me%20glac%C3%A9e

Fiche 34,  Justifications,  Espagnol

Fiche 35,  Justifications,  Anglais

Record number: 35, Textual support number: 1 CONT

<... the top track is fastened to the bottom of the roof purlins and then the wall studs are slid into the top track and fastened with no. 8 self tapping, wafer head screws.  2, fiche 35, Anglais, - top%20track

Fiche 35,  Justifications,  Français

Record number: 35, Textual support number: 1 DEF

Cornière servant de sablière dans un plafond pour monter les montants préfabriqués en acier, pour les cloisons ou murs déplaçables.  1, fiche 35, Français, - rail%20de%20plafond

Fiche 35,  Justifications,  Espagnol

Fiche 36,  Justifications,  Anglais

Record number: 36, Textual support number: 1 CONT

Pre-design research had indicated that part of the turnover problem was caused by "job shock. "Applicants were told about job requirements and given a tour of the Wafer Fab before completing the employment process. However, the nature of the work in a "clean room" and the special clothing required was so foreign to the typical entry-level applicant that, although they thought they would be able to adjust to the conditions, many found they didn’t like the job once they had worked in it for a few days. Some people left after lunch on the first day. Others only lasted for a few days.  2, fiche 36, Anglais, - job%20shock

Fiche 36,  Justifications,  Français

Fiche 36,  Justifications,  Espagnol

Fiche 37,  Justifications,  Anglais

Record number: 37, Textual support number: 1 CONT

Gate Array. A type of ASIC [Application-Specific Integrated Circuit] in which the transistors, gates, and other active circuit elements are fixed on a wafer called a "master slice".  2, fiche 37, Anglais, - master%20slice

Fiche 37,  Justifications,  Français

Record number: 37, Textual support number: 1 DEF

Rondelle de silicium sur laquelle les transistors et résistances sont déja diffusés.  2, fiche 37, Français, - circuit%20mosa%C3%AFque

Record number: 37, Textual support number: 1 OBS

Il ne reste plus qu'à les interconnecter entre eux à la demande pour la rondelle en fonction de la logique désirée.  2, fiche 37, Français, - circuit%20mosa%C3%AFque

Record number: 37, Textual support number: 1 CONT

Circuit mosaïque [...]. On part d'une mosaïque de composants disposés régulièrement sur la surface du circuit; les niveaux de diffusion sont communs à plusieurs circuits [...], mais les niveaux de métallisation permettent une personnalisation du circuit par une interconnexion entre composants spécifiques des fonctions à réaliser [...]  2, fiche 37, Français, - circuit%20mosa%C3%AFque

Fiche 37,  Justifications,  Espagnol

Fiche 38,  Justifications,  Anglais

Record number: 38, Textual support number: 1 CONT

Refined gold, usually of a minimum fineness of 995 parts per 1, 000, in bar or wafer form, the most widely accepted and secure investment method; each bar or plate carries the hallmark of the refiner, its weight and fineness, and is individually numbered. The market price of gold is quoted on gold bullion.  2, fiche 38, Anglais, - hallmark

Fiche 38,  Justifications,  Français

Record number: 38, Textual support number: 1 CONT

Or raffiné, ordinairement d'un aloi d'au moins 995 parties sur 1 000, sous la forme de barres ou de plaquettes; c'est la forme d'investissement la plus sûre et la plus répandue; chaque barre ou plaquette porte le poinçon de l'affineur, son poids et son aloi, ainsi qu'un numéro qui lui est propre; le cours du marché de l'or est coté pour l'or en lingots.  2, fiche 38, Français, - poin%C3%A7on%20de%20l%27affineur

Fiche 38,  Justifications,  Espagnol

Fiche 39,  Justifications,  Anglais

Record number: 39, Textual support number: 1 DEF

An extremely fast, front-end compatible bond process, applicable on almost all wafer materials.  2, fiche 39, Anglais, - silicon%20fusion%20bonding

Record number: 39, Textual support number: 1 CONT

The chip is created using micromachining techniques including silicon fusion bonding and ... piezoresistive sense elements.  3, fiche 39, Anglais, - silicon%20fusion%20bonding

Fiche 39,  Justifications,  Français

Fiche 39,  Justifications,  Espagnol

Fiche 40,  Justifications,  Anglais

Record number: 40, Textual support number: 1 DEF

Result of impurity particles rolling across the specimen wafer surface during epitaxial deposition. This defect, by definition, includes both the snowball and its trail.  1, fiche 40, Anglais, - snowball

Fiche 40,  Justifications,  Français

Fiche 40,  Justifications,  Espagnol

Fiche 41,  Justifications,  Anglais

Record number: 41, Textual support number: 1 CONT

wafer prober. "Cascade Microtech is the acknowledged technology leader for wafer parametric measurement. By combining Cascade's low-noise technology and our advanced production probing capabilities, the EG5300e is unmatched in its ability to make the in-line parametric wafer measurements critical for validating the latest die fabrication processes during production. "  1, fiche 41, Anglais, - wafer%20prober

Fiche 41,  Justifications,  Français

Fiche 41,  Justifications,  Espagnol

Fiche 42,  Justifications,  Anglais

Record number: 42, Textual support number: 1 CONT

DELTA's automatic wafer tester. Wafers with microsystems are tested to sort out bad chips before encapsulation. The testing of microsystems is developed based on DELTA's long experience in testing of ICs(integrated circuits). The test can be purely electrical or(soon) with non-electrical stimuli and detection.  2, fiche 42, Anglais, - wafer%20tester

Fiche 42,  Justifications,  Français

Record number: 42, Textual support number: 1 DEF

Appareil généralement piloté par ordinateur et servant à vérifier le bon fonctionnement et les caractéristiques des circuits intégrés.  2, fiche 42, Français, - testeur%20de%20tranches

Fiche 42,  Justifications,  Espagnol

Fiche 43,  Justifications,  Anglais

Record number: 43, Textual support number: 1 DEF

A precisely doped, thin layer of silicon grown on a p-doped thick wafer and into which n-type semiconductor junctions are diffused. This grown crystal layer(usually doped) has the same crystallographic orientation as the substrate crystal wafer.  3, fiche 43, Anglais, - epitaxial%20layer

Fiche 43,  Justifications,  Français

Fiche 43,  Justifications,  Espagnol

Fiche 44,  Justifications,  Anglais

Record number: 44, Textual support number: 1 DEF

Process of plastic deformation in which one part of a crystal wafer undergoes a shear displacement relative to another in a fashion which preserves the crystallinity of the material. Slip is evidenced by a pattern of one or more straight lines of 10 or more dislocation etch pits per millimetre which do not necessarily touch each other. On(111) oriented wafers, the bases of the triangular dislocation etch pits will be on a common line. Slip patterns can also result from stress relief in a chemically polished wafer. Also, dislocation pit, preferential etch pits, stress effect, pit.  1, fiche 44, Anglais, - crystal%20slip

Fiche 44,  Justifications,  Français

Fiche 44,  Justifications,  Espagnol

Fiche 45,  Justifications,  Anglais

Record number: 45, Textual support number: 1 OBS

Because medium-scale integration(MSI) and large-scale integration(LSI) generally imply digital integrated circuits(ICS), equipment intended to test LSI/MSI devices usually comprises a digital test system. Although manually operated benchtop units are available to test digital logic in a production environment, automated test systems are dictated. Thus, in general, LSI/MSI testers are automated, programmable systems that provide sophisticated test patterns at high repetition rates(usually, rated device operating frequency), with precise edge timing and control of all test parameters. Employed primarily for testing at wafer probe and for final package test(interfaced to a wafer prober or a high-speed, sort devices into predetermined categories based upon test performance, and reject defective devices. A current trend-particularly for semiconductor memories-is to integrate test systems with burn-in systems.  1, fiche 45, Anglais, - LSI%2FMSI%20tester

Fiche 45,  Justifications,  Français

Record number: 45, Textual support number: 1 OBS

LSI signifie «intégration à grande échelle» et MSI «intégration à moyenne échelle.»  1, fiche 45, Français, - appareil%20de%20contr%C3%B4le%20LSI%2FMSI

Fiche 45,  Justifications,  Espagnol

Fiche 46,  Justifications,  Anglais

Record number: 46, Textual support number: 1 CONT

A long, narrow, shallow groove or cut below the established plane of the wafer surface, seen either before or after etching or epitaxy. The ratio of the length of the figure to the width of the figure must be greater than 5 : 1 in order to be defined as a scratch. Macroscratches are equal to or greater than 0. 12 um in depth and must be visible to the unaided eye under both incandescent and fluorescent illumination.  1, fiche 46, Anglais, - macroscratch

Fiche 46,  Justifications,  Français

Fiche 46,  Justifications,  Espagnol

Fiche 47,  Justifications,  Anglais

Record number: 47, Textual support number: 1 CONT

The human genome project is barely complete, and yet scientists already want to put the whole thing on one tiny chip. Well, one "wafer, "to be more precise. Each wafer, a proprietary technology of Perlegen, a Silicon Valley biotech company, will consist of 300 glass slides that can hold the chemical makeup of the entire human genome. On Monday, Brad Margus, president of Perlegen, discussed his company's ambitious effort to put the genomes of 50 individuals on chips so that they could be used to compare differences side by side.  1, fiche 47, Anglais, - wafer

Fiche 47,  Justifications,  Français

Fiche 47,  Justifications,  Espagnol

Fiche 48,  Justifications,  Anglais

Record number: 48, Textual support number: 1 DEF

For a semiconductor slice or wafer, the locus of points in the slice or wafer equidistant between the front and back surfaces.  1, fiche 48, Anglais, - median%20surface

Fiche 48,  Justifications,  Français

Fiche 48,  Justifications,  Espagnol

Fiche 49,  Justifications,  Anglais

Record number: 49, Textual support number: 1 DEF

In wafer sorting, the card containing several probes which is used to automatically check each circuit on a wafer for acceptable electrical function.  1, fiche 49, Anglais, - probe%20card

Fiche 49,  Justifications,  Français

Fiche 49,  Justifications,  Espagnol

Fiche 50,  Justifications,  Anglais

Record number: 50, Textual support number: 1 DEF

Surface texture that results when a wafer floats during the initial stages of chemical polishing in a rotating cup etcher.  1, fiche 50, Anglais, - moon%20crater

Fiche 50,  Justifications,  Français

Fiche 50,  Justifications,  Espagnol

Fiche 51,  Justifications,  Anglais

Record number: 51, Textual support number: 1 DEF

Usually nearly concentric ridges seen on a wafer specimen that was cut from a crystal and then chemically polished and preferentially etched. These ridges are usually caused by nonuniform dope incorporation into the crystal during growth.  1, fiche 51, Anglais, - resistivity%20ring

Fiche 51,  Justifications,  Français

Fiche 51,  Justifications,  Espagnol

Fiche 52,  Justifications,  Anglais

Record number: 52, Textual support number: 1 CONT

A laser scriber can be used in place of a diamond scriber for dicing wafers of silicon, gallium arsenide, and other semiconductor materials used in the production of semiconductor diodes, transistors, and integrated circuits. The laser beam vaporizes grooves in the upper active face of the wafer, after which a breaking operation separates the chips along the grooves. This process can also be used for scribing sapphire and ceramic substrates. It is also used to drill holes in any of these substances.  1, fiche 52, Anglais, - laser%20scriber

Fiche 52,  Justifications,  Français

Fiche 52,  Justifications,  Espagnol

Fiche 53,  Justifications,  Anglais

Record number: 53, Textual support number: 1 OBS

Ion implantation is a precise and reproducible method of doping semiconductors to achieve a desired characteristic. With this equipment, ions of the particular dopant are energized and accelerated to the point where they can be driven in a focused beam directly into the silicon wafer. This technique assures uniform, accurately controlled depth of implantation and ionic diffusion in the wafer, and is highly repeatable on succeeding wafers.  1, fiche 53, Anglais, - ion%20beam%20implantation%20equipment

Fiche 53,  Justifications,  Français

Record number: 53, Textual support number: 1 CONT

équipements de production à commande par programme enregistré par l'implantation ionique ayant des courants du faisceau de 5 m A ou plus.  1, fiche 53, Français, - %C3%A9quipement%20par%20implantation%20ionique

Fiche 53,  Justifications,  Espagnol

Fiche 54,  Justifications,  Anglais

Record number: 54, Textual support number: 1 DEF

Contamination placed upon the wafer surface while holding the wafer with unclean tweezers.  1, fiche 54, Anglais, - tweezer%20residue

Fiche 54,  Justifications,  Français

Fiche 54,  Justifications,  Espagnol

Fiche 55,  Justifications,  Anglais

Record number: 55, Textual support number: 1 DEF

Caused during the wafer slicing operation by the saw blade. A depression made by the blade and not removed by lapping, will still be visible after chemical polishing as a roughened area. This type of defect may not be discernible before chemical polishing.  1, fiche 55, Anglais, - saw%20blade%20defect

Fiche 55,  Justifications,  Français

Fiche 55,  Justifications,  Espagnol

Fiche 56,  Justifications,  Anglais

Record number: 56, Textual support number: 1 CONT

Traditionally impurities were diffused into a wafer through a masking layer in a diffusion furnace. Today impurities are increasingly being implanted into a wafer structure through a process called ion implantation. A diffusion depth tester is used to determine to what depth these diffused impurities have penetrated into the wafer.  1, fiche 56, Anglais, - diffusion%20depth%20tester

Fiche 56,  Justifications,  Français

Fiche 56,  Justifications,  Espagnol

Fiche 57,  Justifications,  Anglais

Record number: 57, Textual support number: 1 DEF

Mark or dirt on the surface of a wafer caused by a vacuum chuck or vacuum pencil.  1, fiche 57, Anglais, - chuck%20mark

Fiche 57,  Justifications,  Français

Fiche 57,  Justifications,  Espagnol

Fiche 58,  Justifications,  Anglais

Record number: 58, Textual support number: 1 DEF

The method of isolating regions of a semiconductor wafer from another by the use of P-N junctions which, in use, are reverse biased.  1, fiche 58, Anglais, - diode%20isolation

Fiche 58,  Justifications,  Français

Fiche 58,  Justifications,  Espagnol

Fiche 59,  Justifications,  Anglais

Record number: 59, Textual support number: 1 CONT

These are designed to bathe boatloads of wafers or other parts in quantity production. The bath vessels should be equipped with heating elements that surround and concentrate the desired heat on the liquid within the bath. This will enable the bath liquid to be heated rapidly(6 °C or more per minute), while also allowing the bath to be very stably operated between 40 ° and 180 °C. Baths should be equipped with a built-in thermistor sensor to regulate the amount of heat, and provide the capability of maintaining a very constant-temperature when necessary. The vessel should be designed to resist thermal shock, be capable of high heat retention, and be impervious to most acids. Wafer baths can be either mounted to the work surface, or they can be used free-standing unit. Vessel size should allow the bat to accept any standard wafer within a wafer carrier.  1, fiche 59, Anglais, - wafer%20bath

Fiche 59,  Justifications,  Français

Fiche 59,  Justifications,  Espagnol