TERMIUM Plus^®

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Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein...  1, fiche 1, Anglais, - burn%2Din

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Évaluation de la qualité. [...] composants électroniques [...] les essais de fin de production et de «déverminage» : ils éliminent les composants potentiellement défectueux, mais ils ne doivent pas être fragilisants. En outre, des inspections visuelles en fin de production sont effectuées et contribuent à cette première sélection des composants.  2, fiche 1, Français, - d%C3%A9verminage

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Burn-in type test of diodes and transistors, conducted with the junctions reverse biased to effect any failure due to ion migration in bonds of dissimilar metals.  1, fiche 2, Anglais, - high%20temperature%20reverse%20bias

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As a minimum all CAM equipment shall be subjected to random vibration test, thermal cycle test, and burn-in test(168 hours at the maximum temperatures specified for the operating mode within the payload).  2, fiche 3, Anglais, - burn%2Din%20test

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Because medium-scale integration(MSI) and large-scale integration(LSI) generally imply digital integrated circuits(ICS), equipment intended to test LSI/MSI devices usually comprises a digital test system. Although manually operated benchtop units are available to test digital logic in a production environment, automated test systems are dictated. Thus, in general, LSI/MSI testers are automated, programmable systems that provide sophisticated test patterns at high repetition rates(usually, rated device operating frequency), with precise edge timing and control of all test parameters. Employed primarily for testing at wafer probe and for final package test(interfaced to a wafer prober or a high-speed, sort devices into predetermined categories based upon test performance, and reject defective devices. A current trend-particularly for semiconductor memories-is to integrate test systems with burn-in systems.  1, fiche 4, Anglais, - LSI%2FMSI%20tester

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LSI signifie «intégration à grande échelle» et MSI «intégration à moyenne échelle.»  1, fiche 4, Français, - appareil%20de%20contr%C3%B4le%20LSI%2FMSI

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Burn-in test which moderates the elevation of temperature and extends the time period in order to test overall device quality as opposed to infant mortality.  1, fiche 5, Anglais, - life%20aging

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Les différentes familles de propergols. Matières premières, compositions, procédés de fabrication, description des caractéristiques fonctionnelles, (incluant sûreté de fonctionnement, sécurité, vulnérabilité, vieillissement et durée de vie).  1, fiche 5, Français, - vieillissement%20et%20dur%C3%A9e%20de%20vie

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Burn-in, or accelerated-temperature-stress testing, may be accomplished in a specific period of time at a constant temperature, or during a series of constant time periods at successively higher temperatures. The latter is sometimes known as step-temperature-stress testing. Devices may be burned-in under static conditions, with bias power applied to their inputs and with their outputs tied to common. They may also be burned in under dynamic conditions, with normal input stimuli applied (including clocks and data).  1, fiche 6, Anglais, - burn%2Din%20test%20equipment

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Special high reliability sockets are used in the burning-in and testing of integrated circuit components. These are called burn-in sockets and they are used to pre-age or precondition all types of IC devices ranging from dual-in-line packages (DIPs) to chip carriers, including flatpacks, TO-5s, quad packs, SO devices, and pin grid arrays.  1, fiche 7, Anglais, - burn%2Din%20test%20socket

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Burn-in board unloaders quickly unload boards after the burn-in process is completed, without damaging the devices. Unloaders are capable of separating good devices from those which have either sustained lead damage or failed the test.  1, fiche 8, Anglais, - burn%2Din%20board%20unloader

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