TERMIUM Plus^®

Fiche 1,  Justifications,  Anglais

Record number: 1, Textual support number: 1 CONT

As a minimum all CAM equipment shall be subjected to random vibration test, thermal cycle test, and burn-in test(168 hours at the maximum temperatures specified for the operating mode within the payload).  2, fiche 1, Anglais, - burn%2Din%20test

Fiche 1,  Justifications,  Français

Fiche 1,  Justifications,  Espagnol

Fiche 2,  Justifications,  Anglais

Record number: 2, Textual support number: 1 OBS

Because medium-scale integration(MSI) and large-scale integration(LSI) generally imply digital integrated circuits(ICS), equipment intended to test LSI/MSI devices usually comprises a digital test system. Although manually operated benchtop units are available to test digital logic in a production environment, automated test systems are dictated. Thus, in general, LSI/MSI testers are automated, programmable systems that provide sophisticated test patterns at high repetition rates(usually, rated device operating frequency), with precise edge timing and control of all test parameters. Employed primarily for testing at wafer probe and for final package test(interfaced to a wafer prober or a high-speed, sort devices into predetermined categories based upon test performance, and reject defective devices. A current trend-particularly for semiconductor memories-is to integrate test systems with burn-in systems.  1, fiche 2, Anglais, - LSI%2FMSI%20tester

Fiche 2,  Justifications,  Français

Record number: 2, Textual support number: 1 OBS

LSI signifie «intégration à grande échelle» et MSI «intégration à moyenne échelle.»  1, fiche 2, Français, - appareil%20de%20contr%C3%B4le%20LSI%2FMSI

Fiche 2,  Justifications,  Espagnol

Fiche 3,  Justifications,  Anglais

Record number: 3, Textual support number: 1 OBS

Burn-in, or accelerated-temperature-stress testing, may be accomplished in a specific period of time at a constant temperature, or during a series of constant time periods at successively higher temperatures. The latter is sometimes known as step-temperature-stress testing. Devices may be burned-in under static conditions, with bias power applied to their inputs and with their outputs tied to common. They may also be burned in under dynamic conditions, with normal input stimuli applied (including clocks and data).  1, fiche 3, Anglais, - burn%2Din%20test%20equipment

Fiche 3,  Justifications,  Français

Fiche 3,  Justifications,  Espagnol