TERMIUM Plus®

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BOLA SOLDADURA [1 record]

Filter results by subject field Alphabetical list of terms

Filter results by subject field

Alphabetical list of terms

Record 1 2023-01-31

English

Subject field(s)
  • Welding and Soldering (Metals)
  • Printed Circuits and Microelectronics
CONT

The PCB [printed circuit board] design will have round landing pads to which the solder balls will be soldered when the package and PCB are heated in a reflow oven.

French

Domaine(s)
  • Soudage (Métal)
  • Circuits imprimés et micro-électronique
CONT

Matrice de billes (BGA) : Paquet SMD [composant monté en surface] dans lequel les interconnexions des billes de soudure couvrent la surface inférieure du paquet.

Spanish

Campo(s) temático(s)
  • Soldadura (Metales)
  • Circuitos impresos y microelectrónica
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