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WIRE BOND [13 records]

Record 1 2023-10-17

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Informatics
CONT

The length of the wire bond determines the total impedance, capacitance, and inductance of the connection. Long wire bonds can be detrimental to the overall package performance.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Informatique

Spanish

Save record 1

Record 2 2011-04-28

English

Subject field(s)
  • Man-Made Construction Materials
  • Applications of Concrete
DEF

A wire provided with a series of small deformations in order to increase its capacity to bond to concrete.

French

Domaine(s)
  • Matériaux de construction artificiels
  • Utilisation du béton
CONT

Il existe des fils à adhérence améliorée soit ondulés, soit crantés ou à empreintes.

Spanish

Save record 2

Record 3 2002-04-23

English

Subject field(s)
  • Electronic Circuits Technology
  • Printed Circuits and Microelectronics
DEF

A measure of the deviation of the wire loop from the straight line between the attachment points of a wire bond.

OBS

Usually, it is the maximum perpendicular distance from this line to the wire loop.

French

Domaine(s)
  • Technologie des circuits électroniques
  • Circuits imprimés et micro-électronique

Spanish

Save record 3

Record 4 2001-06-11

English

Subject field(s)
  • Printed Circuits and Microelectronics
DEF

The realization of a very small fastened joint between conductors or between a conductor and microelectronic chip device. A bond of a small wire such as 0. 001-in-diameter gold to a conductor or to a chip device.

French

Domaine(s)
  • Circuits imprimés et micro-électronique

Spanish

Save record 4

Record 5 2001-06-11

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
DEF

A bond formed when a ball-shaped end interconnecting wire is deformed by thermocompression against a metallized pad. The bond is also designated a nail head bond from the appearance of the flattened ball.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles

Spanish

Save record 5

Record 6 2001-03-15

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

That period of machine cycle at which final adjustments in the location of the second bonding area... under the tool are made prior to lowering the tool for making the second wire bond.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

Save record 6

Record 7 2001-03-15

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
DEF

A wire bond made by laying the wire on the bonding pad and using thermocompression of ultrasonic scrubbing to form the joint.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles
CONT

Lancée en juin, l'expérimentation en cours vise à évaluer en grandeur réelle les usages de cette technologie auprès des utilisateurs (notamment en situation de nomadisme), et à anticiper des offres de services sur mesures pour les entreprises (réseaux locaux sans fil clé en main). Le véritable enjeu consiste à offrir, à terme, une connexion permanente aux utilisateurs même éloignés de leur lieu de travail, tout en leur garantissant des débits de plus en plus importants et une qualité de service constante (connexion en temps réelle et sans couture).

OBS

Par analogie il est possible de proposer l'expression en vedette.

Spanish

Save record 7

Record 8 2000-08-28

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

The difference between the attachment points of the first and second bonds of a wire bond.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

Save record 8

Record 9 2000-08-28

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

The distance measured from the bonding site on the die to the bond impression on the post, substrate land, or fingers, which must be bridged by a bonding wire or ribbon.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

Save record 9

Record 10 2000-08-18

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Scientific Measurements and Analyses
CONT

Wire bond pull testing is an accepted method used to evaluate and/or control mechanical strength of wire bonds in semiconductor or hybrid microcircuit devices. To realize optimum benefits, the test must be carefully performed according to established specifications.... Wire bond testing is important because insufficient bond strength represents one of the largest causes of device failure. Pull tests in the 0. 5-to 10 000-g force range are routinely employed to evaluate and/or control the mechanical strength of wire bonds in semiconductor and hybrid microcircuit devices.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Mesures et analyse (Sciences)

Spanish

Save record 10

Record 11 1998-02-27

English

Subject field(s)
  • Metal Forming
  • Concrete Preparation and Mixing
DEF

Reinforcing wire having machine-made surface identations intended to improve bond, used for either concrete reinforcement or pretensioning depending on type.

French

Domaine(s)
  • Formage des métaux
  • Fabrication du béton
CONT

On trouve l'acier de précontrainte sous forme de fils, torons ou barres. Les fils les plus utilisés sont les fils lisses à section circulaire [...] Il existe des fils à adhérence améliorée soit ondulés, soit crantés ou à empreintes [...]

Spanish

Save record 11

Record 12 1982-06-22

English

Subject field(s)
  • Aeroindustry
CONT

Hughes Aircraft is under contract to the US Air Force to demonstrate for use in manufacturing a new process that coats microelectronic devices with a silicon nitride insulating film, offering several key advantages over previous insulating techniques. Microcircuits are prepared for a reactor chamber designed for the photo-chemical vapour deposition(Photo-CVD) process. Developed by Hughes with company funds, Photo-CVD offers the potential of eliminating wire bond corrosion, device degradation due to leaky standard metal or ceramic hermetic packages, and failure due to loose conductive particles. According to the company, it is not destructive because it does not generate the ionized particles and broadband electromatic radiation encountered in Plasma-CVD and physical sputtering processes.

Key term(s)
  • photochemical vapor deposition
  • photochemical vapour deposition process
  • photo-CVD process

French

Domaine(s)
  • Constructions aéronautiques
CONT

(...) la société Hughes Aircraft effectue des travaux visant à démontrer la possibilité d'utiliser, pour la fabrication en série des microcircuits, le procédé de déposition de vapeur photochimique appelé Photo-CVD (photochemical vapour deposition). (...) ce procédé consiste à déposer un film isolant de nitrure de silicium, lequel évite la corrosion aux points de soudure des fils, les dégradations imputables à un manque d'étanchéité des boîtiers et les pannes pouvant être provoquées par des particules conductrices détachées. Le film ne provoque lui-même aucune détérioration, étant donné qu'il ne produit ni particules ionisées ni rayonnement électromagnétique à large bande comme c'est le cas avec le procédé Plasma-CVD et les méthodes classiques de pulvérisation.

Spanish

Save record 12

Record 13 1982-03-23

English

Subject field(s)
  • Signalling (Rail Transport)
OBS

RSCF 22. A piece of metal driven into a hole in the rail to form an electrical connection between the rail and the bond wire.

French

Domaine(s)
  • Signalisation (Transport par rail)
OBS

RSCF 22. Pièce métallique introduite dans un trou d'un rail pour assurer une liaison électrique entre le rail et le conducteur de connexion.

Spanish

Save record 13

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