TERMIUM Plus®

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WIRE BONDER [2 records]

Record 1 2004-01-07

English

Subject field(s)
  • Semiconductors (Electronics)
  • Spacecraft
CONT

During the year, ASM Pacific succeeded in becoming a major wire bonder supplier to the world's largest IC [integrated circuit] assembler which is located in Korea, largely due to the unique ultra fine pitch bonding capability of our AB339 gold wire bonder.

French

Domaine(s)
  • Semi-conducteurs (Électronique)
  • Engins spatiaux

Spanish

Save record 1

Record 2 2001-11-08

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
DEF

The heating element in a eutectic die bonder or wire bonder used to bring the substrate up to the bonding temperature.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique

Spanish

Save record 2

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