TERMIUM Plus^®

Record 1,  Textual support,  English

Record number: 1, Textual support number: 1 DEF

The method used to attach very fine wires to semiconductor components to interconnect these components with each other or with package leads.  5, record 1, English, - wire%20bond%20method

Record number: 1, Textual support number: 1 CONT

Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip.  1, record 1, English, - wire%20bond%20method

Record 1,  Textual support,  French

Record 1,  Textual support,  Spanish

Record 2,  Textual support,  English

Record number: 2, Textual support number: 1 DEF

An integrated circuit surface mount package with an area array of solder balls that are attached to the bottom side of a substrate with routing layers.  3, record 2, English, - ball%20grid%20array

Record number: 2, Textual support number: 1 OBS

The die is attached to the substrate using die and wire bonding or flip-chip interconnection.  3, record 2, English, - ball%20grid%20array

Record 2,  Textual support,  French

Record number: 2, Textual support number: 1 DEF

Boîtier matriciel dont les sorties sont des billes de soudure.  1, record 2, French, - bo%C3%AEtier%20matriciel%20%C3%A0%20billes

Record number: 2, Textual support number: 1 OBS

Nouvelle technologie utilisée pour la fabrication entièrement automatisée de circuits intégrés.  2, record 2, French, - bo%C3%AEtier%20matriciel%20%C3%A0%20billes

Record number: 2, Textual support number: 2 OBS

boîtier matriciel à billes; boîtier à billes : termes et définition publiés au Journal officiel de la République française le 27 décembre 2009.  3, record 2, French, - bo%C3%AEtier%20matriciel%20%C3%A0%20billes

Record 2,  Textual support,  Spanish

Record 3,  Textual support,  English

Record number: 3, Textual support number: 1 DEF

A stamped or etched metal frame, usually connected with wire bonding to bonding pads of a die, that provides external electrical connections for a packaged electrical device.  3, record 3, English, - lead%20frame

Record number: 3, Textual support number: 1 OBS

lead frame: term standardized by IEC.  4, record 3, English, - lead%20frame

Record 3,  Textual support,  French

Record number: 3, Textual support number: 1 DEF

Grille métallique découpée formant les broches de certains boîtiers de composants et leur prolongement moulé dans le boîtier isolant à l'extrémité duquel est soudé une connexion du composant.  1, record 3, French, - grille%20de%20connexion

Record number: 3, Textual support number: 1 OBS

grille de connexion : terme normalisé par la CEI.  3, record 3, French, - grille%20de%20connexion

Record 3,  Textual support,  Spanish

Record 4,  Textual support,  English

Record number: 4, Textual support number: 1 DEF

A chip that has on its termination pads a bump of solder or other bonding material that is used to bond the chip to external contacts.  1, record 4, English, - bump%20chip

Record number: 4, Textual support number: 1 OBS

This allows for simultaneous bonding of all leads at once rather than one at a time as in wire bonding.  1, record 4, English, - bump%20chip

Record 4,  Textual support,  French

Record 4,  Textual support,  Spanish

Record 5,  Textual support,  English

Record number: 5, Textual support number: 1 CONT

During the year, ASM Pacific succeeded in becoming a major wire bonder supplier to the world's largest IC [integrated circuit] assembler which is located in Korea, largely due to the unique ultra fine pitch bonding capability of our AB339 gold wire bonder.  2, record 5, English, - bonding%20capability

Record 5,  Textual support,  French

Record 5,  Textual support,  Spanish

Record 6,  Textual support,  English

Record number: 6, Textual support number: 1 DEF

The heating element in a eutectic die bonder or wire bonder used to bring the substrate up to the bonding temperature.  1, record 6, English, - heat%20column

Record 6,  Textual support,  French

Record 6,  Textual support,  Spanish

Record 7,  Textual support,  English

Record number: 7, Textual support number: 1 DEF

A method of mounting flip chips on thick-or thin-film circuits without the need for subsequent wire bonding.  1, record 7, English, - flip%2Dchip%20mounting

Record 7,  Textual support,  French

Record 7,  Textual support,  Spanish

Record 8,  Textual support,  English

Record number: 8, Textual support number: 1 DEF

The failure of bonding wire to form the loop defined by the path of the bonding tool between bonds.  1, record 8, English, - sagging%20wire

Record 8,  Textual support,  French

Record 8,  Textual support,  Spanish

Record 9,  Textual support,  English

Record number: 9, Textual support number: 1 DEF

A wire bond made by laying the wire on the bonding pad and using thermocompression of ultrasonic scrubbing to form the joint.  1, record 9, English, - stitch%20bond

Record 9,  Textual support,  French

Record number: 9, Textual support number: 1 CONT

Lancée en juin, l'expérimentation en cours vise à évaluer en grandeur réelle les usages de cette technologie auprès des utilisateurs (notamment en situation de nomadisme), et à anticiper des offres de services sur mesures pour les entreprises (réseaux locaux sans fil clé en main). Le véritable enjeu consiste à offrir, à terme, une connexion permanente aux utilisateurs même éloignés de leur lieu de travail, tout en leur garantissant des débits de plus en plus importants et une qualité de service constante (connexion en temps réelle et sans couture).  1, record 9, French, - connexion%20par%20couture

Record number: 9, Textual support number: 1 OBS

Par analogie il est possible de proposer l'expression en vedette.  2, record 9, French, - connexion%20par%20couture

Record 9,  Textual support,  Spanish

Record 10,  Textual support,  English

Record number: 10, Textual support number: 1 DEF

That period of machine cycle at which final adjustments in the location of the second bonding area... under the tool are made prior to lowering the tool for making the second wire bond.  1, record 10, English, - second%20search

Record 10,  Textual support,  French

Record 10,  Textual support,  Spanish

Record 11,  Textual support,  English

Record number: 11, Textual support number: 1 CONT

Large wire bonding tool. Large wire bonding uses a variety of tool shapes and sizes. Large wire is defined as wire diameters in the range of. 003"/75µm to 0. 20"/500µm.  1, record 11, English, - bonding%20tool

Record 11,  Textual support,  French

Record number: 11, Textual support number: 1 CONT

Activez l'outil pour connexion enroulée. Cela fait pivoter le forêt à connexion enroulée et enroule le fil autour du terminal.  1, record 11, French, - outil%20pour%20connexion

Record 11,  Textual support,  Spanish

Record 12,  Textual support,  English

Record number: 12, Textual support number: 1 DEF

In wire bonding, insufficiently deforming the wire, with the bonding tool, during the bonding process.  1, record 12, English, - underbonding

Record 12,  Textual support,  French

Record 12,  Textual support,  Spanish

Record 13,  Textual support,  English

Record number: 13, Textual support number: 1 DEF

Insufficient deformation of the wire by the bonding tool occurring during the bonding operation.  1, record 13, English, - underdeformed

Record 13,  Textual support,  French

Record number: 13, Textual support number: 1 OBS

Comme le terme de base est déformation lorsque l'on parle d'un fil, il est possible de proposer l'équivalent en vedette.  1, record 13, French, - sous%20d%C3%A9form%C3%A9

Record number: 13, Textual support number: 2 OBS

Déformation du fil.  2, record 13, French, - sous%20d%C3%A9form%C3%A9

Record 13,  Textual support,  Spanish

Record 14,  Textual support,  English

Record number: 14, Textual support number: 1 DEF

A tool used in bonding where the wire is fed to the bonding surface of the tool through a bore located along the long axis of the tool.  1, record 14, English, - capillary%20tool

Record 14,  Textual support,  French

Record 14,  Textual support,  Spanish

Record 15,  Textual support,  English

Record number: 15, Textual support number: 1 DEF

The distance measured from the bonding site on the die to the bond impression on the post, substrate land, or fingers, which must be bridged by a bonding wire or ribbon.  1, record 15, English, - bond%2Dto%2Dbond%20distance

Record 15,  Textual support,  French

Record 15,  Textual support,  Spanish

Record 16,  Textual support,  English

Record number: 16, Textual support number: 1 DEF

A bonding tool in the general form of a wedge with or without a wire-guide hole to position the wire under the bonding face of the tool, as opposed to a capillary-type tool.  1, record 16, English, - wedge%20tool

Record 16,  Textual support,  French

Record 16,  Textual support,  Spanish

Record 17,  Textual support,  English

Record number: 17, Textual support number: 1 DEF

Materials, such as vegetable gums, cationic starches, potato starch, sodium aluminate, colloidal animal glue, acrylamide resin, etc., added to the papermaking process at the paper machine headbox, fan pump, or other location close to the wire. They are added in small amounts for the express purpose of maximizing the retention of fillers by altering their electrical charge or bonding.  1, record 17, English, - retention%20aids

Record 17,  Textual support,  French

Record number: 17, Textual support number: 1 CONT

Pour accroître la rétention des charges, on a recours à des séquestrants (...) ou des floculants (...) : sulfate d'aluminium, polyacrylamide, polyéthylène-imine, mélamine-formol, amidon cationique, etc.  1, record 17, French, - s%C3%A9questrants

Record 17,  Textual support,  Spanish