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HERMETIC PACKAGE [6 records]

Record 1 2026-02-13

English

Subject field(s)
  • Electronic Components
  • Printed Circuits and Microelectronics
  • IT Security
CONT

The vast majority of ICs [integrated circuits] gets individually encapsulated in a hermetic package before being soldered onto printed circuit boards(PCB).

CONT

In remarking, the counterfeiters remove the old marking on the package (or even on the die) and mark them again with forged information. During the remarking process, the components’ packages are sanded or ground down to remove old markings (part number, date code, country of origin, etc.).

French

Domaine(s)
  • Composants électroniques
  • Circuits imprimés et micro-électronique
  • Sécurité des TI
DEF

Enveloppe protégeant un ou plusieurs composants et comportant des traversées pour le raccordement à l'extérieur.

CONT

Une fois réalisées, les puces sont testées directement sur le wafer, puis celui-ci est découpé. Chaque puce ainsi obtenue est placée dans un boîtier, les entrées et les sorties du circuit réalisé sur la puce sont connectées aux broches du boîtier [...] Une fois le boîtier fermé, le circuit intégré est testé et livré au client de la fonderie.

OBS

boitier : Cette graphie, puisée du document intitulé «Les rectifications de l'orthographe» du Conseil supérieur de la langue française, est attestée dans le Larousse.

OBS

boîtier : désignation et définition publiées au Journal officiel de la République française le 26 mars 2002.

Spanish

Campo(s) temático(s)
  • Componentes electrónicos
  • Circuitos impresos y microelectrónica
  • Seguridad de IT
CONT

Se denomina chip al conjunto de la oblea de silicio (donde se ha fabricado el circuito electrónico) y el encapsulado (formado, habitualmente, por la carcasa y los pines de interconexión). Esta carcasa suele construirse de material plástico o cerámico aunque, excepcionalmente, puede ser de metal [...]

CONT

Circuito integrado: se considera un circuito electrónico funcional constituido por un conjunto de transistores, diodos, resistencias y condensadores, fabricados en un mismo proceso, sobre un sustrato común llamado chip, en su posición natural y dentro de una misma cápsula.

Save record 1

Record 2 2010-10-14

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Industrial Techniques and Processes
DEF

Filling an evacuated hybrid circuit package with dry inert gas prior to hermetic sealing of the package.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Techniques industrielles

Spanish

Save record 2

Record 3 2002-05-03

English

Subject field(s)
  • Electrical Measuring Equipment
  • Printed Circuits and Microelectronics
CONT

The purpose of the Particle Induced Noise Detection(PIND) test is to detect any loose foreign particles that may be present in a hermetic package.(The test is inapplicable to plastic-encapsulated devices).

French

Domaine(s)
  • Appareils de mesures (Électricité)
  • Circuits imprimés et micro-électronique

Spanish

Save record 3

Record 4 1999-12-06

English

Subject field(s)
  • Measuring Instruments
  • Scientific Measurements and Analyses
  • Air Conditioning and Heating
DEF

[A] device used to detect refrigerant leaks from equipment. The device may operate on any of a number of physical or chemical principles and may be limited to detecting only specific classes of refrigerants.

CONT

Applied only to hermetic devices, the fine-leak detectors are used to detect defects in sealing that are too small to be detected by gross-leak. The devices to be tested are placed in a bomb that is then pressurized with a mixture of 90 percent nitrogen and 10 percent krypton 85. Under pressure, the gas will enter the package through any seal defects that are present. The bomb is then evacuated, and the devices "washed" with nitrogen to remove any krypton that may be on their surface.

French

Domaine(s)
  • Appareils de mesure
  • Mesures et analyse (Sciences)
  • Conditionnement de l'air et chauffage
DEF

[...] tout appareil ou dispositif permettant de déceler les fuites de fluide frigorigène.

Spanish

Save record 4

Record 5 1992-08-18

English

Subject field(s)
  • Industrial Techniques and Processes
  • Printed Circuits and Microelectronics
CONT

Semiconductor chips require encapsulation for protection against the environment in which they must operate. The encapsulation is either in an hermetic or non-hermetic package, depending on environmental or reliability considerations. Sealing boats and accessories are instrumental in the assembly of most hermetic packages. Their primary functions are to align and/or hold in place various packaging components for final seal.

French

Domaine(s)
  • Techniques industrielles
  • Circuits imprimés et micro-électronique
OBS

Proposition basée sur combustion boat = nacelle de combustion.

Spanish

Save record 5

Record 6 1992-04-10

English

Subject field(s)
  • Telecommunications
  • Electrical Engineering

French

Domaine(s)
  • Télécommunications
  • Électrotechnique

Spanish

Save record 6

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