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BGA [1 record]

Record 1 2011-11-02

English

Subject field(s)
  • Electronic Components
  • Printed Circuits and Microelectronics
  • Electronic Circuits Technology
DEF

An integrated circuit surface mount package with an area array of solder balls that are attached to the bottom side of a substrate with routing layers.

OBS

The die is attached to the substrate using die and wire bonding or flip-chip interconnection.

Key term(s)
  • land grid array
  • pad grid array
  • pad array carrier
  • ball-grid array

French

Domaine(s)
  • Composants électroniques
  • Circuits imprimés et micro-électronique
  • Technologie des circuits électroniques
DEF

Boîtier matriciel dont les sorties sont des billes de soudure.

OBS

Nouvelle technologie utilisée pour la fabrication entièrement automatisée de circuits intégrés.

OBS

boîtier matriciel à billes; boîtier à billes : termes et définition publiés au Journal officiel de la République française le 27 décembre 2009.

Spanish

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