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BONDING CAPABILITY [1 record]

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Record 1 2004-01-07

English

Subject field(s)
  • Semiconductors (Electronics)
  • Spacecraft
CONT

During the year, ASM Pacific succeeded in becoming a major wire bonder supplier to the world's largest IC [integrated circuit] assembler which is located in Korea, largely due to the unique ultra fine pitch bonding capability of our AB339 gold wire bonder.

French

Domaine(s)
  • Semi-conducteurs (Électronique)
  • Engins spatiaux

Spanish

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TERMIUM Plus®, the Government of Canada's terminology and linguistic data bank
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