TERMIUM Plus®

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WIRE BOND [6 records]

Record 1 2023-10-17

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Informatics
CONT

The length of the wire bond determines the total impedance, capacitance, and inductance of the connection. Long wire bonds can be detrimental to the overall package performance.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Informatique

Spanish

Save record 1

Record 2 2022-08-11

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Informatics
DEF

The method used to attach very fine wires to semiconductor components to interconnect these components with each other or with package leads.

CONT

Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Informatique

Spanish

Save record 2

Record 3 2017-02-22

English

Subject field(s)
  • Electronics
  • Printed Circuits and Microelectronics
  • Electrical Engineering
DEF

An electrical connection formed by wire between two points on a printed board added after the intended conductive pattern is formed.

OBS

jumper wire; jumper: terms officially approved by the Lexicon Project Committee (New Brunswick).

French

Domaine(s)
  • Électronique
  • Circuits imprimés et micro-électronique
  • Électrotechnique
DEF

Fil conducteur, habituellement isolé, qui sert de connexion entre deux points d'un circuit imprimé à couche simple.

OBS

fil volant; cavalier : termes uniformisés par le Comité du projet de lexiques (Nouveau-Brunswick).

Spanish

Save record 3

Record 4 2000-08-18

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Scientific Measurements and Analyses
CONT

Wire bond pull testing is an accepted method used to evaluate and/or control mechanical strength of wire bonds in semiconductor or hybrid microcircuit devices. To realize optimum benefits, the test must be carefully performed according to established specifications. ... Wire bond testing is important because insufficient bond strength represents one of the largest causes of device failure. Pull tests in the 0.5- to 10 000-g force range are routinely employed to evaluate and/or control the mechanical strength of wire bonds in semiconductor and hybrid microcircuit devices.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Mesures et analyse (Sciences)

Spanish

Save record 4

Record 5 1992-04-10

English

Subject field(s)
  • Measurements of Electricity
  • Electromagnetic Radiation

French

Domaine(s)
  • Mesures de grandeurs électriques
  • Rayonnements électromagnétiques

Spanish

Save record 5

Record 6 1992-02-14

English

Subject field(s)
  • Switchgear (Rail Transport)
  • Rolling and Suspension Components (Railroad)
OBS

(rail bond).

OBS

Term(s) officially approved by CP Rail.

French

Domaine(s)
  • Appareils de voie (Transport par rail)
  • Roulement et suspension (Chemins de fer)
OBS

(connexion électrique de joint).

OBS

Terme(s) uniformisé(s) par CP Rail.

Spanish

Save record 6

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