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WIRE BOND METHOD [1 record]

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Record 1 2022-08-11

English

Subject field(s)
  • Printed Circuits and Microelectronics
  • Informatics
DEF

The method used to attach very fine wires to semiconductor components to interconnect these components with each other or with package leads.

CONT

Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
  • Informatique

Spanish

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