TERMIUM Plus®

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VIA CONICA [1 record]

Filter results by subject field Alphabetical list of terms

Filter results by subject field

Alphabetical list of terms

Record 1 2022-06-13

English

Subject field(s)
  • Printed Circuits and Microelectronics
CONT

To maintain acceptable wiring pitches at higher wiring levels, thicker insulators necessitate the use of vertical interconnects (studs/plugs) instead of tapered vias to be filled when depositing the next level of metal.

French

Domaine(s)
  • Circuits imprimés et micro-électronique

Spanish

Campo(s) temático(s)
  • Circuitos impresos y microelectrónica
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