TERMIUM Plus®

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VIA TRAVES SILICIO [1 record]

Record 1 2020-09-25

English

Subject field(s)
  • Printed Circuits and Microelectronics
DEF

A perpendicularly penetrating [electro-interconnection] between both surfaces of a silicon substrate.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
DEF

Interconnexion électronique pénétrant perpendiculairement entre les deux surfaces d'un substrat de silicium.

OBS

TSV : Ce sigle est la forme abrégée de la désignation anglaise «through-silicon via».

Spanish

Campo(s) temático(s)
  • Circuitos impresos y microelectrónica
CONT

Las vías a través del silicio ​o TSV son conexiones verticales que atraviesan por completo tanto las obleas de silicio como las superficies individuales de los circuitos integrados, conocidas como pastillas o dados.

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