TERMIUM Plus®

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SOUDAGE THERMOCOMPRESSION [2 records]

Record 1 2000-08-18

English

Subject field(s)
  • Printed Circuits and Microelectronics
DEF

A bond made with a wedge tool.

French

Domaine(s)
  • Circuits imprimés et micro-électronique
DEF

Procédé de soudage des connexions qui consiste à placer, à l'aide d’un outil manipulateur, le fil parallèlement à la surface métallisée sur laquelle on veut le fixer. Un deuxième outil, en forme de coin, sert à appuyer le fil et à effectuer la thermocompression du fil sur le circuit intégré.

Spanish

Save record 1

Record 2 1992-10-28

English

Subject field(s)
  • Electronics

French

Domaine(s)
  • Électronique
DEF

Procédé de soudage des connexions dans lequel un même outil dépose le fil sur le circuit et le soude sur la puce par thermocompression ou par ultrasons.

Spanish

Save record 2

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