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PLANARISATION POLISSAGE CHIMICO-MECANIQUE [1 record]

Record 1 2010-12-20

English

Subject field(s)
  • Printed Circuits and Microelectronics
CONT

Polishing and planarization are related in that polishing improves the flatness (planarity), smoothness and optical properties of a surface. Planarization, however, is a much more critical process. Integrated circuit (IC) manufacturers must planarize each surface layer of an in-process wafer to make it level for the next application of microlithography. Chemical mechanical planarization (CMP) is used during the semiconductor manufacturing process to planarize individual layers in complex integrated circuits to customer-specific parameters.

Key term(s)
  • chemical-mechanical planarization
  • chemical mechanical planarisation
  • chemical-mechanical planarisation

French

Domaine(s)
  • Circuits imprimés et micro-électronique
CONT

La société [Novellus Systems Inc.] est spécialisée dans les équipements avancés pour la déposition, le traitement de surface et la planarisation chimico-mécanique conçus pour les besoins de la fabrication de masse de semi-conducteurs au moindre coût.

Key term(s)
  • planarisation chimicomécanique
  • planarisation chimico mécanique
  • aplanissement chimicomécanique
  • aplanissement chimico mécanique

Spanish

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